Samsung Electro-Mechanics announced in late June that it will invest an additional 300 billion won in the construction of semiconductor packaging substrate (FCBGA) facilities. This investment will be used for FCBGA’s facilities in Busan, South Korea, Sejong Works, and Vietnam.
Samsung Electro-Mechanics said that through this investment, it plans to actively respond to the increase in demand for packaging substrates brought about by the high performance of semiconductors and market growth.
In particular, it will realize mass production of packaging substrates for servers within the year for the first time in South Korea, and strengthen its position as the top three in the world by expanding high-end products such as servers, networks, and vehicles.
The packaging substrate is a substrate that connects large-scale integrated circuit chips and motherboards and transmits electrical signals and currents.
Samsung Electro-Mechanics explained that the demand for high-end packaging substrates from the world’s top customer companies is increasing, and the demand for packaging substrates for automotive vehicles is also increasing due to the expansion of autonomous driving.
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